The measured nitrogen concentration profiles are shown in
Fig. 1. For all intents and purposes, the profile peaks
at the surface, with a peak concentration of 40-45%. The
concentration actually decreases very near the surface, but this has
little effect on the finite element solution and it has been ignored.
This profile decreases roughly linearly to the bulk concentration at
100-125 nm. The nitrogen concentration profile is shallower than one
might expect from conventional ion implantation because the PSII
process implants a mixture of N and N
. Computer
simulations of the implantation have been performed, and the agreement
between the simulations and the measured nitrogen profile was
excellent [12]. This provides some indication that the profile
measurement is reliable. Based on this result, the finite element
model included a yield stress profile that peaked at the surface and
decreased linearly to the bulk value at 100 nm. This model thus
assumes that the primary hardening mechanism is the formation of
titanium nitride, as has been found in prev studies [16].
It should be made clear, though, that there was no attempt to directly
assess the existence of titanium nitride in the samples used for
this study.